Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore.
The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.
Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore ...
Micron Technology initiated construction on (January 8, 2025) of a new High-Bandwidth Memory (HBM) advanced packaging ...
Micron’s data center revenue surged 4X YoY and 40% sequentially in Q1-FY25, contributing 55% of consolidated revenue. High ...
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Driven by growing chip demand in 2025, analysts at Jefferies predict ASML Holding ( ASML) will likely enjoy a boom in orders ...
Tesla wants to integrate the next-gen high-bandwidth memory into its Dojo system. Dojo is a custom-built supercomputer ...
Nvidia’s CEO Jensen Huang expressed confidence that Samsung will overcome challenges in producing high-bandwidth memory chips ...
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Mizuho analysts project a positive 2025 for chipmakers, supported by robust artificial intelligence (AI) demand, data center ...
Micron stock surges after Nvidia CEO praises their chips at CES. But mixed technical signals may impact the rally.