CEO Jensen Huang confirmed its advanced packaging needs from Taiwan Semiconductor Manufacturing Company (NYSE:TSM) are changing, according to a report by Reuters. Blackwell, Nvidia's latest artificial intelligence chip,

Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) and US-based artificial intelligence (AI) chip designer Nvidia Corp have partnered with each other on silicon photonics development, Nvidia founder and CEO Jensen Huang (黃仁勳) said.

Meanwhile, a slew of other tech executives including Elon Musk, Jeff Bezos and Mark Zuckerberg are reportedly set to attend the events on Monday.

When Taiwanese media reported on Nvidia CEO Jensen Huang dining with TSMC, supply chain partners, and AI server company executives, curiosity arose about the VIPs accompanying Huang during his visits

Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.

NVIDIA CEO Jensen Huang says his company is working with TSMC to create new opportunities in robotics and autonomous vehicles, will fight Tesla.

Nvidia CEO Jensen Huang Huang said he will be celebrating Lunar New Year with employees.

Last week, Jensen Huang, CEO of NVIDIA, visited Taiwan and met with high-ranking officials from Taiwanese partners, including Wei Zhe Zha, CEO of TSMC. They reportedly focused on seeking technological collaboration for NVIDIA's artificial intelligence (AI ...

Jensen Huang invited around 35 chief executives from various Nvidia partners to lunch, which led to the media calling it the 'trillion dollar' banquet.

TSMC is advancing its compact optical engine technology, branded as COUPE, a top priority among its emerging innovations. Nvidia CEO Jensen Huang, during a recent visit to Taiwan, highlighted collaboration with TSMC on silicon photonics,

The shocking success of a new model from a mysterious Chinese lab has America questioning its leadership of the sector.

NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition to CoWoS-L packaging.