Freescale Semiconductor has developed a new packaging technology that could replace BGA and flip chip as the dominant packaging and assembly approach for highly-integrated semiconductors... Freescale ...
Freescale Semiconductor is setting up a pilot production line at its facility in Tempe, Ariz. for its recently announced Redistributed Chip Packaging (RCP) technology in preparation for volume ...
Freescale Semiconductor today announced it is setting up a pilot production line at its facility in Tempe, Ariz., for its redistributed chip packaging (RCP) technology in preparation for volume ...
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