IC packaging, typically an afterthought in the design of a new-generation SoC, is particularly troublesome for communications circuits and high-speed interface circuits. Everyone wants small size and ...
For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.
Customers creating multi-chip(let) advanced packages for hyperscale and networking applications can achieve accelerated productivity through streamlined design, analysis and verification reference ...
Advanced packaging techniques are viewed as either a replacement for Moore’s Law scaling, or a way of augmenting it. But there is a big gap between the extensive work done to prove these devices can ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Samsung Foundry has certified the complete Cadence ® system analysis and advanced packaging design ...
Industry’s only OpenAccess-based integration of Calibre DRC speeds path to foundry sign-off and shortens design cycle of custom chips HSINCHU, Taiwan, March 11, 2011 — SpringSoft, Inc., a global ...
Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...
According to the report, the market for 3D IC and 2.5D IC packaging is projected to grow substantially from an estimated USD 58.3 billion in 2025 to approximately USD 138.0 billion by 2035, reflecting ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the certification of the Cadence ® tools in TSMC reference flows for TSMC’s latest InFO and CoWoS ® ...
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