The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to expand ...

Over 81% of new digital designs utilize Field Programmable Gate Arrays (FPGAs). With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is ...

The plastic Ball Grid Array (BGA) and Low profile Fine pitch BGA (LFBGA) packages have developed over recent years from being rarely used devices, to become, for many applications, the first choice ...

Samsung has started mass producing the industry's first NVMe PCIe solid state drive (SSD) in a single ball grid array (BGA) package, for use in next-generation PCs and ultra-slim notebook PCs. Armed ...

It’ll come as no surprise to any savvy buyer, and certainly not to any design engineer, that each new generation of electronic products packs more performance into a smaller package than the product ...

Simple and inexpensive semiconductor devices in earlier generations of electronic systems were easily discarded or recycled when they were damaged either before or during the printed circuit board ...

The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...

[Jack Gassett] is developing a new breakout board for an FPGA. The chip comes in a ball grid array (BGA) package which is notoriously difficult to solder reliably. Since he’s still in development, the ...

Much has changed in IC packaging technology since the first real-time microfocus X-ray systems entered the inspection market nearly 20 years ago. The trend for high-density packaging is moving from ...