Samsung has announced a new type of V-NAND, with three bits per cell and 48 layers per chip. The company wants to make terabyte-class SSDs much more popular than they currently are, in both data ...

Applied Materials, Inc. today announced its breakthrough Applied Producer(R) Eterna(TM) FCVD(TM) (Flowable CVD(1)) system, the first and only film deposition technology capable of electrically ...

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s first 256-gigabit ...

Modern semiconductor processes are extremely complicated and involve thousands of interacting individual process steps. During the development of these process steps, roadblocks and barriers are often ...

Just over a week ago we reported upon Toshiba and SanDisk unveiling the world's first 256Gb, 48-Layer BiCS NAND. Toshiba/SanDisk will start sampling its latest chips next month, with mass production ...

[section label=1. Samsung Announces 256Gb 48-Layer 3-Bit MLC 3D V-NAND] Samsung has begun mass production of the industry’s first 256Gb 48-layer 3-bit MLC (TLC)3D V-NAND flash memory just one year ...

SK Hynix has successfully developed a 72-layer 256 Gigabit TLC 3D NAND flash chip, the company announced. It will allow one chip to hold 32 Gigabytes of memory. It makes it the most advanced, ahead of ...

It's the world's first 64-layer 3D NAND solution, delivering the smallest chip area of any published 3D NAND. The initial plans are to deploy BiCS3 in 256 gigabit capacity followed by a range of ...

It’s the tale of two promising and separate 3D chip architectures. One technology is slowly taking root, while the other one is heating up. 3D stacked-die using through-silicon vias (TSVs) is on the ...

Samsung Electronics has expanded the availability of its 64-layer, 256-Gigabit, 3-bit V-NAND from solid-state drives to include mobiles and PCs, the company has announced. The fourth-generation V-NAND ...

It's been clear for several years that three-dimensional NAND die stacking, in which chip layers are oriented vertically as opposed to horizontal planar structures was the way forward for ...

Toshiba and Western Digital are now turning out samples of 3D NAND chips with 64 layers of memory cells, marking the next stage in the technology's evolution. The inside of the Toshiba's manufacturing ...